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1

Applications of Multilinear and Waveform Relaxation Methods for Efficient Simulation of Interconnect-Dominated Nonlinear Networks

Beyene, Wendemagegnehu (Wendem) T.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.07 MB

english, 2008

2

Foreword Special Section on High-Speed I/O Channels

Beyene, Wendem T.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 241 KB

english, 2009

3

[IEEE 2008 IEEE Symposium on VLSI Circuits - Honolulu, HI, USA (2008.06.18-2008.06.20)] 2008 IEEE Symposium on VLSI Circuits - A 16Gb/s/link, 64GB/s bidirectional asymmetric memory interface cell

Ken Chang,, Haechang Lee,, Jung-Hoon Chun,, Ting Wu,, TJ Chin,, Kambiz Kaviani,, Jie Shen,, Xudong Shi,, Wendem Beyene,, Yohan Frans,, Brian Leibowitz,, Nhat Nguyen,, Fredy Quan,, Jared Z

Year:

2008

Language:

english

File:

PDF, 386 KB

english, 2008

4

[IEEE 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2018.10.14-2018.10.17)] 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Analysis of Noise Coupling and Timing Error in Silicon Bridge Application

Yoon, Changwook, Chen, Guang, Greenhill, David, Kang, Hyo-Soon, Hashemi, Ashkan, Beyene, Wendem

Year:

2018

Language:

english

File:

PDF, 493 KB

english, 2018

5

[IEEE 2012 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2012.02.19-2012.02.23)] 2012 IEEE International Solid-State Circuits Conference - A 0.4mW/Gb/s 16Gb/s near-ground receiver front-end with replica transconductance termination calibration

Kaviani, Kambiz, Amirkhany, Amir, Huang, Charlie, Le, Phuong, Madden, Chris, Saito, Keisuke, Sano, Koji, Murugan, Vinod, Beyene, Wendem, Chang, Ken, Yuan, Chuck

Year:

2012

Language:

english

File:

PDF, 478 KB

english, 2012

6

[IEEE 2012 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2012.02.19-2012.02.23)] 2012 IEEE International Solid-State Circuits Conference - A 4.1pJ/b 16Gb/s coded differential bidirectional parallel electrical link

Amirkhany, Amir, Kaviani, Kambiz, Abbasfar, Aliazam, Shuaeb, Fazeel, Beyene, Wendem, Hoshino, Chikara, Madden, Chris, Chang, Ken, Yuan, Chuck

Year:

2012

Language:

english

File:

PDF, 142 KB

english, 2012

7

A 4.1-pJ/b, 16-Gb/s Coded Differential Bidirectional Parallel Electrical Link

Amirkhany, Amir, Kaviani, Kambiz, Abbasfar, Aliazam, Fazeel, Shuaeb, Beyene, Wendem, Hoshino, Chikara, Madden, Chris, Chang, Ken, Yuan, Chuck

Journal:

IEEE Journal of Solid-State Circuits

Year:

2012

Language:

english

File:

PDF, 2.26 MB

english, 2012

8

[IEEE 2011 IEEE Asian Solid-State Circuits Conference (A-SSCC) - Jeju, South Korea (2011.11.14-2011.11.16)] IEEE Asian Solid-State Circuits Conference 2011 - On overcoming the limitations of single-ended signaling for graphics memory interfaces

Amirkhany, Amir, Beyene, Wendem, Madden, Chris, Abbasfar, Aliazam, Secker, Dave, Oh, Dan, Hekmat, Mohammad, Schmitt, Ralf, Yuan, Chuck

Year:

2011

Language:

english

File:

PDF, 2.00 MB

english, 2011

9

[IEEE 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2011.10.23-2011.10.26)] 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - Jitter modeling and analysis (M-XI)

Beyene, Wendem, Jiao, Dan

Year:

2011

File:

PDF, 100 KB

2011

10

[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Industry session V: Package requirements for high-speed links: 50 Gb/s and beyond

Year:

2016

Language:

english

File:

PDF, 221 KB

english, 2016

11

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Design Optimization and Accurate Extraction of On-die Decoupling Capacitors for High-Performance Applications

Liu, Xiaoping, Ren, Jihong, Beyene, Wendem, Ku, Simon, Heah, Chin Hong, Hsu, Sherman

Year:

2018

File:

PDF, 713 KB

2018

12

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Design Optimization and Accurate Extraction of On-die Decoupling Capacitors for High-Performance Applications

Liu, Xiaoping, Ren, Jihong, Beyene, Wendem, Ku, Simon, Heah, Chin Hong, Hsu, Sherman

Year:

2018

Language:

english

File:

PDF, 713 KB

english, 2018